Six Sigma in a Semiconductor Company

被引：0

作者：

Riding, Karen D. ^{[1
]}

Bruedern, Dirk-Alexander ^{[1
]}

机构：

[1] GLOBALFOUNDRIES, Corp Mfg Ctr Excellence, Malta, NY 12533 USA

来源：

2014 25TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2014年

关键词：

Six Sigma; semiconductor; Lean; Lean Six Sigma (L65); quality; Define-Measure-Analyze-Improve-Control (DMAIC); Design for Six Sigma (DFSS); Measurement System Analysis (MSA); Cause and Effect Diagram (Fishbone); Failure Modes and Effects Analysis (FMEA); Analysis of Variance (ANOVA); Design of Experiments (DOE); SIPOC (Supplier-Input-Process-Output-Customer);

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Lean and Six Sigma have been practiced by many companies over the last 15 years. Lean and Six Sigma are used to deliver breakthrough improvements in the business processes of a company, not incremental improvements. Lean and Six Sigma deployments are only successful if management in a company support, drive and buy-in to this approach to address business concerns. In this article, the methods, learnings and challenges will be described with the deployment of Lean Six Sigma in a ramping semiconductor company.

引用

页码：230 / 235

页数：6

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