Diffusion of copper along the grain boundaries in aluminum

被引：6
|
作者：
Dolgopolov, N. A. [1 ]
Rodin, A. O. [1 ]
Simanov, A. V. [1 ]
Gontar', I. G. [1 ]
机构：
[1] State Tech Univ, Moscow Steel & Alloys Inst, Moscow 119049, Russia
来源：
RUSSIAN JOURNAL OF NON-FERROUS METALS | 2009年 / 50卷 / 02期
关键词：
grain boundaries; diffusion of copper; aluminum; GROWTH;
D O I：
10.3103/S1067821209020114
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The grain boundary diffusion (GBD) of copper in aluminum is investigated in the range t = 300-400A degrees C. Investigations were performed on a scanning electron microscope equipped with an attachment for electron probe X-ray microanalysis. The triple product s delta D (gb) (where s is the segregation coefficient, delta is the width of the grain boundary, and D (gb) is the GBD coefficient) was calculated by the Fisher criterion using two methods (namely, the copper concentration in the grain boundary, depending on the penetration depth, was determined and the angles in the vertex of the concentration profile was measured using an optical microscope). In the first case, s delta D (gb) was 5.1 x 10(-11) exp(-102/(RT)) m(3)/s; in the second case it was 1.4 x 10(-11) exp(-94/(RT)) m(3)/s. The obtained results are compared with innumerous literature data.
引用
收藏
页码：133 / 137
页数：5
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