Design of multi-finger HBT's with a thermal-electrical model

被引：0
|
作者：
Chang, YH [1 ]
Chang-Chiang, CC [1 ]
Lee, YC [1 ]
Liu, CC [1 ]
机构：
[1] Natl Yunlin Univ Sci & Technol, Tou Liu 64045, Yun Lin, Taiwan
来源：
2002 IEEE HONG KONG ELECTRON DEVICES MEETING, PROCEEDINGS | 2002年
关键词：
HBT; multi-finger; thermal effect;
D O I：
10.1109/HKEDM.2002.1029165
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Temperature distribution on the emitter fingers of heterojunction bipolar transistors (HBT's) is studied with a three-dimensional thermal-electrical model. Using this model, multi-finger HBT's is designed with non-uniform spacing. An efficient design procedure is presented. Te calculated results show significant temperature reduction on non-uniform spacing devices.
引用
收藏
页码：95 / 98
页数：4
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