Volume manufacturing challenges of HDI

被引：0

作者：

Hu, M ^{[1
]}

Barbetta, M ^{[1
]}

机构：

[1] HADCO Santa Clara Inc, Santa Clara, CA USA

来源：

SMTA INTERNATIONAL PROCEEDINGS OF THE HIGH DENSITY INTERCONNECT SYMPOSIUM | 1999年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

When people talked about microvias a few years ago, the subject usually focused around the alternatives in via formation. Today, as the designers are packing more functionality into limited space, the PWB manufacturers are also busy turning out integrated high density interconnect (HDI) solutions. in this article, we will review the market trends of HDI technology, discuss the manufacturing challenges: via formation, registration and plating.

引用

页码：36 / 40

页数：5

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