Mechanical design aspects during full-scale development process of electronic assemblies for military systems

被引：0
|
作者：
Ramot, Medy [1 ]
机构：
[1] RAFAEL, Missile Div, Dept Mech, Elect Packaging Sect, IL-31021 Haifa, Israel
来源：
Advances in Electronic Packaging 2005, Pts A-C | 2005年
关键词：
D O I：
10.1115/IPACK2005-73026
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Full-scale development of an electronic assembly is a very complex process conducted by a multidisciplinary team. The process involves numerous professional skills, the main being: Electrical, Mechanical, Software, Component and Reliability engineering. Electronic assemblies designed for military applications, require high quality performance, long life cycle (storage and mission profiles) and operation in harsh environmental conditions. This paper presents main aspects of the mechanical design and the issues to be considered during the full-scale development process of electronic units used in military systems.
引用
收藏
页码：827 / 833
页数：7
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