NONDESTRUCTIVE TESTING OF DEFECT IN A C/SiC COMPOSITE

In this paper, thermography, X-ray radiography, and industrial computed tomography (CT) were used to detect the blind holes drilled in the back side of a C/SiC composite panel. Diameters and depths of the hole defect were measured by nondestructive testing methods tentatively. Results show that it is very easy for thermography to measure the diameter (D) and depth (d) of each hole defect through a series of thermal images with time, and the errors in diameter measurement decrease with the increase of D/d. X-ray radiography can also detect the hole defects of the C/SiC composites in different brightness, whereas CT is applicable to further determine the exact localization of the defects of interest in all three-dimensional spatial directions.