photocathode film;
r-HiPIMS plus ECWR plasma;
r-HiPIMS plasma;
copper iron oxide;
photocurrent;
RADIOFREQUENCY CURRENT;
ION CURRENT;
PHOTOCATHODES;
PERFORMANCE;
D O I:
10.3390/coatings10030232
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
A reactive high-power impulse magnetron sputtering (r-HiPIMS) and a reactive high-power impulse magnetron sputtering combined with electron cyclotron wave resonance plasma source (r-HiPIMS + ECWR) were used for the deposition of p-type CuFexOy thin films on glass with SnO2F conductive layer (FTO). The aim of this work was to deposit CuFexOy films with different atomic ratio of Cu and Fe atoms contained in the films by these two reactive sputtering methods and find deposition conditions that lead to growth of films with maximum amount of delafossite phase CuFeO2. Deposited copper iron oxide films were subjected to photoelectrochemical measurement in cathodic region in order to test the possibility of application of these films as photocathodes in solar hydrogen production. The time stability of the deposited films during photoelectrochemical measurement was evaluated. In the system r-HiPIMS + ECWR, an additional plasma source based on special modification of inductively coupled plasma, which works with an electron cyclotron wave resonance ECWR, was used for further enhancement of plasma density ne and electron temperature T-e at the substrate during the reactive sputtering deposition process. A radio frequency (RF) planar probe was used for the determination of time evolution of ion flux density i(ionflux) at the position of the substrate during the discharge pulses. Special modification of this probe to fast sweep the probe system made it possible to determine the time evolution of the tail electron temperature T-e at energies around floating potential V-fl and the time evolution of ion concentration n(i). This plasma diagnostics was done at particular deposition conditions in pure r-HiPIMS plasma and in r-HiPIMS with additional ECWR plasma. Generally, it was found that the obtained ion flux density i(ionflux) and the tail electron temperature T-e were systematically higher in case of r-HiPIMS + ECWR plasma than in pure r-HiPIMS during the active part of discharge pulses. Furthermore, in case of hybrid discharge plasma excitation, r-HiPIMS + ECWR plasma has also constant plasma density all the time between active discharge pulses n(i) approximate to 7 x 10(16) m(-3) and electron temperature T-e approximate to 4 eV, on the contrary in pure r-HiPIMS n(i) and T-e were negligible during the "OFF" time between active discharge pulses. CuFexOy thin films with different atomic ration of Cu/Fe were deposited at different conditions and various crystal structures were achieved after annealing in air, in argon and in vacuum. Photocurrents in cathodic region for different achieved crystal structures were observed by chopped light linear voltammetry and material stability by chronoamperometry under simulated solar light and X-ray diffraction (XRD). Optimization of depositions conditions results in the desired Cu/Fe ratio in deposited films. Optimized r-HiPIMS and r-HiPIMS + ECWR plasma deposition at 500 degrees C together with post deposition heat treatment at 650 degrees C in vacuum is essential for the formation of stable and photoactive CuFeO2 phase.
机构:
Univ Wisconsin, Dept Mat Sci & Engn, 1509 Univ Ave, Madison, WI 53706 USAUniv Wisconsin, Dept Mat Sci & Engn, 1509 Univ Ave, Madison, WI 53706 USA
Maeng, Wanjoo
Lee, Seung-Hwan
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机构:
Hanyang Univ, Div Mat Sci & Engn, 222 Wangshimni Ro, Seoul 133719, South KoreaUniv Wisconsin, Dept Mat Sci & Engn, 1509 Univ Ave, Madison, WI 53706 USA
Lee, Seung-Hwan
Kwon, Jung-Dae
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机构:
Korea Inst Mat Sci, Adv Funct Thin Films Dept, Chang Won 641831, South KoreaUniv Wisconsin, Dept Mat Sci & Engn, 1509 Univ Ave, Madison, WI 53706 USA
Kwon, Jung-Dae
Park, Jozeph
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机构:
Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
Samsung Display Inc, Yongin, South KoreaUniv Wisconsin, Dept Mat Sci & Engn, 1509 Univ Ave, Madison, WI 53706 USA
机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Yang, L. L.
Ye, Z. Z.
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机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Ye, Z. Z.
Zhu, L. P.
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机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Zhu, L. P.
Zeng, Y. J.
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机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Zeng, Y. J.
Lu, Y. F.
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机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
Lu, Y. F.
Zhao, B. H.
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机构:
Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R ChinaZhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China