Key Enablers for 3D Sequential Integration

被引：0
|
作者：
Brunet, Laurent [1 ]
机构：
[1] Cea Leti, Grenoble, France
来源：
2016 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [21] 3D Integration
    Gupta, Piyush
    2019 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2019,
  • [22] Towards 500°C SPER activated devices for 3D Sequential Integration
    Micout, J.
    Sklenard, B.
    Batude, P.
    Berthelon, R.
    Rafhay, Q.
    Lacord, J.
    Mathieu, B.
    Pasini, L.
    Saghi, Z.
    Delaye, V.
    Brunet, L.
    Fenouillet-Beranger, C.
    Joblot, S.
    Mazen, F.
    Mazzocchi, V.
    Colinge, J-P.
    Ghibaud, G.
    Vinet, M.
    2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2017,
  • [23] Guidelines for intermediate Back End Of Line (BEOL) for 3D sequential integration
    Fenouillet-Beranger, C.
    Beaurepaire, S.
    Deprat, F.
    de Sousa, A. Ayeres
    Brunet, L.
    Batude, P.
    Rozeau, O.
    Andrieu, F.
    Besombes, P.
    Samson, M. -P.
    Previtali, B.
    Nemouchi, F.
    Rodriguez, G.
    Rodriguez, P.
    Famulok, R.
    Rambal, N.
    Balan, V.
    Saghi, Z.
    Jousseaume, V.
    Guerin, C.
    Ibars, F.
    Proud, F.
    Nouguier, D.
    Ney, D.
    Delaye, V.
    Dansas, H.
    Federspiel, X.
    Vinet, M.
    2017 47TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC), 2017, : 252 - 255
  • [24] 3D Sequential Integration: Application-driven technological achievements and guidelines
    Batude, P.
    Brunet, L.
    Fenouillet-Beranger, C.
    Andrieu, F.
    Colinge, J-P.
    Lattard, D.
    Vianello, E.
    Thuries, S.
    Billoint, O.
    Vivet, P.
    Santos, C.
    Mathieu, B.
    Sklenard, B.
    Lu, C. -M. V.
    Micout, J.
    Deprat, F.
    Mercado, E. Avelar
    Ponthenier, F.
    Rambal, N.
    Samson, M. -P.
    Cassc, M.
    Hentz, S.
    Arcamone, J.
    Sicard, G.
    Hutin, L.
    Pasini, L.
    Ayres, A.
    Rozeau, O.
    Berthelon, R.
    Nemouchi, F.
    Rodriguez, P.
    Pin, J-B.
    Larmagnac, D.
    Dubous, A.
    Ripoche, V.
    Barraud, S.
    Allouti, N.
    Barola, S.
    Vizioz, C.
    Hartmann, J. -M.
    Kerdiles, S.
    Alba, P. Acosta
    Beaurepaire, S.
    Beugin, V.
    Fournel, F.
    Besson, P.
    Loup, V.
    Gassilloud, R.
    Martin, E.
    Garros, X.
    2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2017,
  • [25] 3D printed microfluidic devices: enablers and barriers
    Waheed, Sidra
    Cabot, Joan M.
    Macdonald, Niall P.
    Lewis, Trevor
    Guijt, Rosanne M.
    Paull, Brett
    Breadmore, Michael C.
    LAB ON A CHIP, 2016, 16 (11) : 1993 - 2013
  • [26] Through Silicon Vias as Enablers for 3D Systems
    Jung, Erik
    Ostmann, A.
    Ramm, P.
    Wolf, J.
    Toepper, M.
    Wiemer, M.
    DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 119 - +
  • [27] 3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS
    Batude, Perrine
    Ernst, Thomas
    Arcamone, Julien
    Arndt, Gregory
    Coudrain, Perceval
    Gaillardon, Pierre-Emmanuel
    IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2012, 2 (04) : 714 - 722
  • [28] INTEGRATION OF 3D AUDIO AND 3D VIDEO FOR FTV
    Tehrani, Mehrdad Panahpour
    Yendo, Tomohiro
    Fujii, Toshiaki
    Takeda, Kazuya
    Mase, Kenji
    Tanimoto, Masayuki
    2009 3DTV-CONFERENCE: THE TRUE VISION - CAPTURE, TRANSMISSION AND DISPLAY OF 3D VIDEO, 2009, : 265 - +
  • [29] Progress of 3D integration technologies and 3D interconnects
    Pozder, Scott
    Chatterjee, Ritwik
    Jain, Ankur
    Huang, Zhihong
    Jones, Robert E.
    Acosta, Eddie
    PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2007, : 213 - 215
  • [30] Inter-tier Dynamic Coupling and RF Crosstalk in 3D Sequential Integration
    Sideris, P.
    Lugo-Alvarez, J.
    Batude, P.
    Brunet, L.
    Acosta-Alba, P.
    Kerdiles, S.
    Fenouillet-Beranger, C.
    Sicard, G.
    Rozeau, O.
    Andrieu, F.
    Colinge, J-P.
    Ghibaudo, G.
    Theodorou, C.
    2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2019,
12345