Silica-Based Packaging Structure for D-band RF module

被引：0
|
作者：
Ito, Masaharu [1 ]
Marumoto, Tsunehisa [1 ]
机构：
[1] NEC Corp Ltd, Kawasaki, Kanagawa 2118666, Japan
来源：
2018 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM - IMS | 2018年
关键词：
band-pass filters; dielectric substrates; electro-magnetic propagation; millimeter wave devices; wireless communication; WAVE-GUIDE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. The fabricated three-resonator filters show small deviations in frequency responses among samples along with good filter performances.
引用
收藏
页码：871 / 874
页数：4
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