Signal Processing Techniques for Nondestructive Evaluation Using Laser Ultrasonics

被引:1
|
作者
Klein, Marvin B. [1 ]
Ansari, Homayoon [1 ]
机构
[1] Intelligent Opt Syst, Torrance, CA 90505 USA
来源
2009 IEEE INTERNATIONAL SYMPOSIUM ON SIGNAL PROCESSING AND INFORMATION TECHNOLOGY (ISSPIT 2009) | 2009年
关键词
laser ultrasonics; adhesive inspection; crack measurement;
D O I
10.1109/ISSPIT.2009.5407572
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Laser ultrasonics is a form of ultrasonic evaluation in which a pulsed laser generates an ultrasonic wave in a sample which interrogates a specific feature. When this wave returns to the surface a separate laser interferometer detects the small resulting displacement. This technique is strictly noncontact and is thus suitable for in-process inspection of parts at high temperature or moving at high speed. In many applications the acquired temporal signals have features which differ from those acquired using conventional transducers. In this paper we will describe these features and discuss techniques which have been used to process these signals.
引用
收藏
页码:316 / 321
页数:6
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