Residual stress measurement in sputtered copper thin films by synchrotron radiation and ordinary X-rays

被引：0
|
作者：
Hataya, M [1 ]
Hanabusa, T [1 ]
Kusaka, K [1 ]
Tominaga, K [1 ]
Matsue, T [1 ]
Sakata, O [1 ]
机构：
[1] Univ Tokushima, Dept Mech Engn, Tokushima 770, Japan
来源：
RESIDUAL STRESSES VII, PROCEEDINGS | 2005年 / 490-491卷
关键词：
nano-size thin film; copper film; synchrotron radiation; X-rays; residual stress;
D O I：
10.4028/www.scientific.net/MSF.490-491.661
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：661 / 666
页数：6
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