Two-stage polymer embossing of co-planar microfluidic features for microfluidic devices

被引：28
|
作者：
Koesdjojo, Myra T. [1 ]
Tennico, Yolanda H. [1 ]
Rundel, Jack T. [1 ]
Remcho, Vincent T. [1 ]
机构：
[1] Oregon State Univ, Dept Chem, Corvallis, OR 97331 USA
来源：
SENSORS AND ACTUATORS B-CHEMICAL | 2008年 / 131卷 / 02期
关键词：
polyetherimide; PEI; amorphous polyethylene terephthalate; APET; glass transition temperature; hot embossing; microfluidic;
D O I：
10.1016/j.snb.2008.01.008
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
A two-stage embossing technique for fabricating microchannels for microfluidic devices is presented. A Micromachined aluminum mold is used to emboss a polyetherimide (PEI) substrate with a relatively high glass transition temperature (T-g). The embossed PEI is then used as a mold for embossing an amorphous polyethylene terephthalate (APET) substrate with a lower T-g. The resulting APET substrate has the same features as those of the aluminum mold. Successful transfer of features from the aluminum mold to the APET substrate was verified by profilometry, and an application of this method in production of a microfluidic device is presented. (c) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码：692 / 697
页数：6
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