Wick-free paradigm for high-performance vapor-chamber heat spreaders

被引:28
|
作者
Damoulakis, George [1 ]
Megaridis, Constantine M. [1 ]
机构
[1] Univ Illinois, Dept Mech & Ind Engn, Chicago, IL 60607 USA
关键词
Wickless; Vapor chamber; Wettability patterning; Multiphase heat transfer; Evaporation; Condensation; ENHANCING DROPWISE CONDENSATION; THERMAL PERFORMANCE; WETTABILITY;
D O I
10.1016/j.enconman.2021.115138
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this study, a novel vapor chamber featuring wickless wettability-patterned components is designed, fabricated, and tested. This is the first phase-change heat transfer apparatus comprised entirely of wick-free elements that transport liquid by way of wetting forces generated by precise surface-wettability patterning. Our approach takes advantage of the phase-changing properties of water within a closed loop composed of two opposing, wickless wettability-patterned plates, one acting as an evaporator, and the other designed as a condenser. The plates feature different geometric wettability patterns, each especially designed/engineered to transform a flat rectangular copper plate to a functional component of a low-profile vapor chamber. The wettability pattern of the condenser facilitates spatially controlled dropwise and filmwise condensation and offers an optimal way to move the condensate through specifically built wedge tracks utilizing capillary forces. The wettability pattern laid on the evaporator enables the collection/accumulation and transport of the returning condensate fluid to the heatinput portion where evaporation must be strongest for maximum heat removal. Using this system, we effectively cooled a 0.9 cm2 heated area by spreading the heating power (-200 W) over a 30x larger condenser area. The best performance metrics were thermal resistance 0.18 K/W at 10 W, in-plane thermal conductivity 1.17 kW/ (m.K) at 22 W, and maximum heat flux - 2.2 MW/m2. The present wick-free vapor-chamber heat-spreader apparatus is the first of its type and the simplicity of its design along with its moderate dimensions (making it light and thin) are important advantages that make this system well-suited for a wide range of thermal management applications.
引用
收藏
页数:12
相关论文
共 50 条
  • [21] Development of a high performance vapor chamber for high heat flux applications
    Zhao, Yuan
    Chen, Chung-Lung
    PROCEEDINGS OF THE MICRO/NANOSCALE HEAT TRANSFER INTERNATIONAL CONFERENCE 2008, PTS A AND B, 2008, : 1023 - 1028
  • [22] Design, development and tests of high-performance silicon vapor chamber
    Cai, Qingjun
    Chen, Bing-chung
    Tsai, Chialun
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (03)
  • [23] EXPERIMENTAL ANALYSIS FOR THERMAL PERFORMANCE OF A VAPOR CHAMBER APPLIED TO HIGH-PERFORMANCE SERVERS
    Wang, Rong-Tsu
    Wang, Jung-Chang
    Chang, Tien-Li
    JOURNAL OF MARINE SCIENCE AND TECHNOLOGY-TAIWAN, 2011, 19 (04): : 353 - 360
  • [24] Thermally anisotropic composite heat spreaders for enhanced thermal management of high-performance microprocessors
    Suszko, Arthur
    El-Genk, Mohamed S.
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2016, 100 : 213 - 228
  • [25] Vapor chamber with two-layer liquid supply evaporator wick for high-heat-flux devices
    Liu, Chao
    Hu, Dinghua
    li, Qiang
    Chen, Xuemei
    Zhang, Zhiwei
    Zhou, Fan
    APPLIED THERMAL ENGINEERING, 2021, 190
  • [26] Pool Boiling Performance of a Sintered Aluminum Powder Wick for a Lightweight Vapor Chamber
    Ou, Liwen
    Jiang, Xingchi
    Zhang, Shiwei
    Tang, Yong
    Zhong, Guisheng
    Li, Jie
    MACHINES, 2023, 11 (04)
  • [27] On the transient thermal response of thin vapor chamber heat spreaders: Optimized design and fluid selection
    Patankar, Gaurav
    Weibel, Justin A.
    Garimella, Suresh, V
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2020, 148
  • [28] High performance vapor chamber enabled by leaf-vein-inspired wick structure for high-power electronics cooling
    Zhou, Guohui
    Zhou, Jingzhi
    Huai, Xiulan
    APPLIED THERMAL ENGINEERING, 2023, 230
  • [29] Improving the thermal performance of thin vapor chamber by optimizing screen mesh wick structure
    Liu, Tengqing
    Yan, Wentao
    Yang, Xin
    Wang, Shuangfeng
    THERMAL SCIENCE AND ENGINEERING PROGRESS, 2022, 36
  • [30] Vapor Chamber in High Performance Server
    Wang, Jung-Chang
    Chen, Teng-Chieh
    IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 329 - 332