Nanocomposite resists for electron beam nanolithography

被引:37
|
作者
Hu, YQ
Wu, HP
Gonsalves, K
Merhari, L
机构
[1] Univ Connecticut, Inst Mat Sci, Dept Chem, Storrs, CT 06269 USA
[2] Univ Connecticut, Inst Mat Sci, Polymer Program, Storrs, CT 06269 USA
[3] CERAMEC R&D, F-87000 Limoges, France
关键词
nanocomposite resist system; e-beam lithography; proximity effect;
D O I
10.1016/S0167-9317(01)00420-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel nanocomposite resist system was developed for sub-100 nm resolution e-beam lithography by dispersing surface-treated silica nanoparticles in a commercial ZEP520((R)) resist. At 4.0 wt % loading of silica nanoparticles, the system exhibited a much higher resolution than ZEP520((R)) without sacrificing the intrinsic high sensitivity and contrast of the starting polymer. The first major result is that 46 nm-wide isolated lines were obtained in the nanocomposite system, whereas comparatively 130 nm-wide lines were obtained in ZEP520((R)) under the same experimental conditions. Moreover, it was shown that the addition of silica nanoparticles resulted in a higher resistance of the nanocomposite to plasma etching with O-2 gas. The major resolution improvement indicates that the nanocomposite is a promising candidate resist for sub-100 am resolution e-beam lithography. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:289 / 294
页数:6
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