Passive Voltage Contrast Investigation of Metal/Via Stack Connecting to Substrate

被引：0
|
作者：
Shen, Yi Qiang [1 ]
Irene, Tee [1 ]
Zhu, Jie [1 ]
Mo, Zhi Qiang [1 ]
机构：
[1] GLOBALFOUNDRIES, 60 Woodlands Ind Pk D,St 2, Singapore 738406, Singapore
来源：
2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2018年
关键词：
fault isolation; passive voltage contrast; modelling; SECONDARY; YIELDS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a detailed study of passive voltage contrast on a metal/via/active chain ET structure is performed. Both electron-beam and ion-beam based PVC techniques are tried with different experimental settings. It is found that electron-beam based PVC cannot provide significant contrast at the failure site. The ion-beam based PVC successfully isolates the failure location. Moreover, some interesting PVC contrast changes with different settings are also observed. FIB cross section reveals the failure mechanism. Based on the failure mechanism and theoretical models, the observed PVC contrast can be explained.
引用
收藏
页数：5
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