Rupture of a Subcooled Liquid Film Falling Down a Heated Grooved Surface

被引：21

作者：

Zaitsev, D. V. ^{[1
,2
,3
]}

Aviles, M. Lozano ^{[4
]}

Auracher, H. ^{[4
]}

Kabov, O. A. ^{[1
,5
]}

机构：

[1] Inst Thermophys SB RAS, Novosibirsk 630090, Russia

[2] ULB, Heat Transfer Int Res Inst, B-1050 Brussels, Belgium

[3] IT SB RAS, B-1050 Brussels, Belgium

[4] Berlin Univ Technol, Inst Energy Engn, D-10587 Berlin, Germany

[5] Univ Libre Bruxelles, Micrograv Res Ctr, Chim Phys EP CP165 62, B-1050 Brussels, Belgium

来源：

MICROGRAVITY SCIENCE AND TECHNOLOGY | 2007年 / 19卷 / 3-4期

关键词：

Heat Flux; Liquid Film; Copper Plate; Film Flow; Groove Surface;

D O I：

10.1007/BF02915756

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

This paper presents an experimental study of rupture of a subcooled water film falling down an 1 m long heated copper plate with longitudinal grooves of 0.5x0.15 mm(2) cross sectional area and 2 mm spacing. It was found that the threshold heat flux at which an initial stable dry patch forms on the grooved surface is about two times higher than that on a smooth surface. Furthermore, the grooves prevent dry patches from spreading over the total heated surface thus essentially delaying the onset of the heat transfer crisis. The main governing parameters of the experiment and their respective values are: initial film temperature (20-95 degrees C), heat flux (0-1.26 W/cm(2)) and volumetric flow rate (11.1-38.2 l/h) (Re=56.2-653.2).

引用

页码：71 / 74

页数：4

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