High-Throughput Direct Adaptive Imaging System with Novel Measurement Tool for Heterogeneous Integration

Demand of heterogeneous integration has increased for high-performance computing devices, utilizing panel level packaging and high-resolution lithography. We have developed a flexible direct imaging tool and a high-speed chip position measurement tool for Fan-Out Panel Level Packaging (FO-PLP). The imaging tool is capable of 2/2 mu m Line/Space resolution, chip displacement exposure compensation and includes an Auto-Wiring function which can expose patterns to connect individual chips independent of position displacement. With measurement tool throughput of 30 Panel Per Hour (PPH), the combination of these tools enables high-throughput adaptive patterning for cost effective heterogeneous integration.