In-situ tensile and fatigue behavior of electrical grade Cu alloy for subsea cables

被引:5
|
作者
Wan, Di [1 ]
Hagen, Anette Brocks [2 ]
Viespoli, Luigi Mario [2 ]
Johanson, Audun [3 ]
Berto, Filippo [1 ]
Alvaro, Antonio [1 ,2 ]
机构
[1] Norwegian Univ Sci & Technol, Dept Mech & Ind Engn, Richard Birkelands Vei 2B, N-7491 Trondheim, Norway
[2] SINTEF Ind, Dept Mat & Nanotechnol, N-7456 Trondheim, Norway
[3] Nexans Norway, Innspurten 9, N-0663 Oslo, Norway
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2022年 / 835卷
关键词
Copper; Tensile test; Cyclic loading; Scanning electron microscopy (SEM); Electron backscattered diffraction (EBSD); Electron channeling contrast imaging (ECCI); COPPER SINGLE-CRYSTALS; SUBSTRUCTURE EVOLUTION; CYCLIC DEFORMATION; DUCTILE FRACTURE; DISLOCATION; SIZE; MICROSTRUCTURE; BOUNDARIES; STRENGTH; VACUUM;
D O I
10.1016/j.msea.2022.142654
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Distribution of electrical energy through subsea power cables has an increasingly important role in the renewable power generation. The majority of the subsea cables uses copper (Cu) as a conductor material. Cables suspended from sea level to sea floor are subjected to both static and cyclic loads that can introduce microstructural damage due to fatigue, creep and their interaction. In addition, since the manufacturing process of the stranded conductor results in Cu-materials with superficial irregularities and metallurgical anisotropy, the material performances need to be carefully addressed in order to reliably assess the wires life. In order to provide a deeper insight into the occurring damage mechanisms, monotonic and cyclic tests of micro-sized Cu tensile specimens were carried out using in-situ micromechanical testing, inside a scanning electron microscopy (SEM) equipped with an electron backscatter diffraction. Tensile and cyclic loading behavior are discussed in correlation with the damage mechanisms observed directly and post-mortem. The twin boundary fraction in the microstructure is found to be linked to the deformation status, and thus can potentially be used as an indicator for predicting the remaining life of the material under service conditions.
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收藏
页数:10
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