Environmentally assisted debonding of copper/barrier interfaces

被引：27

作者：

Birringer, Ryan P. ^{[1
]}

Shaviv, Roey ^{[2
]}

Besser, Paul R. ^{[3
]}

Dauskardt, Reinhold H. ^{[1
]}

机构：

[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA

[2] Novellus Syst Inc, San Jose, CA 95134 USA

[3] GLOBALFOUNDRIES, Sunnyvale, CA 94085 USA

来源：

ACTA MATERIALIA | 2012年 / 60卷 / 05期

关键词：

Copper; Environmentally assisted cracking; Hydrogen; Nitride; Oxidation; CRACK-GROWTH; COPPER; ADHESION; ELECTROMIGRATION; OXIDATION; FRACTURE; TDDB;

D O I：

10.1016/j.actamat.2012.01.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Environmentally assisted debonding at Cu/barrier interfaces is reported for oxidizing and reducing environments. Both moist and dry oxidizing environments are considered, and the effects of different oxidizing species and their chemical activity on the rate of debonding of a Cu/SiN interface is quantified. The type of oxidizing species is shown to play a critical role in the kinetics of environmentally assisted debonding. Additionally, the effect of varying the activity and temperature of reducing hydrogen environments is investigated. The mechanisms responsible for environmentally assisted debonding of Cu/SiN and Cu/SiCN interfaces are elucidated using an atomistic bond rupture model. An activation energy for debonding of Cu/SiCN interfaces in a hydrogen environment is calculated. Finally, a connection between environmentally assisted debonding and the time-dependent dielectric breakdown properties of Cu interconnects is proposed. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：2219 / 2228

页数：10

共 50 条

[21] Piezospectroscopic analysis of interface debonding in thermal barrier coatings
Peng, X
Clarke, DR
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2000, 83 (05) : 1165 - 1170
[22] Study on Ultrasonic Assisted Chemical Debonding Process
Fan, Zengyan
Lin, Huiqin
Chen, Tony
Li, Ming
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 949 - 951
[23] Electrolytically assisted debonding of adhesives: An experimental investigation
Leijonmarck, Simon
Cornell, Ann
Danielsson, Carl-Ola
Akermark, Torbjoern
Brandner, Birgit D.
Lindbergh, Goeran
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2012, 32 : 39 - 45
[24] Exact Localization of Debonding Defects in Thermal Barrier Coatings
Jiao, Da-Cheng
Liu, Zhan-Wei
Zhu, Wen-Ying
Xie, Hui-Min
AIAA JOURNAL, 2018, 56 (09) : 3691 - 3700
[25] MECHANICS OF COMPOSITE MEDIA WITH PARTIAL DEBONDING AT PHASE INTERFACES.
Pelekh, B.L.
Mechanics of Composite Materials, 1984, 20 (04) : 415 - 421
[26] STRENGTH VERSUS ENERGY DEBONDING CRITERIA AT FIBER MATRIX INTERFACES
HSUEH, CH
COMPOSITES ENGINEERING, 1992, 2 (08): : 665 - 675
[27] Mechanics of laser-assisted debonding of films
Tavernier, PR
Clarke, DR
JOURNAL OF APPLIED PHYSICS, 2001, 89 (03) : 1527 - 1536
[28] Assessment of HWD Ability to Detect Debonding of Pavement Layer Interfaces
Amir, Sadoun
Michael, Broutin
Jean-Michel, Simonin
8TH RILEM INTERNATIONAL CONFERENCE ON MECHANISMS OF CRACKING AND DEBONDING IN PAVEMENTS, 2016, 13 : 763 - 769
[29] Debonding behaviors of CFRP strengthened RC beams with weak interfaces
Li, Sen
Wang, Xiaogang
Zhou, Xingang
ADVANCES IN CIVIL STRUCTURES, PTS 1 AND 2, 2013, 351-352 : 587 - 591
[30] Cohesive zone model simulation of fatigue debonding along interfaces
Moroni, F.
Pirondi, A.
11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11), 2011, 10 : 1829 - 1834

← 1 2 3 4 5 →