Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

被引：40
|
作者：
Yan, Jianfeng [1 ]
Zou, Guisheng [1 ]
Wu, Aiping [1 ]
Ren, Jialie [1 ]
Hu, Anming [2 ]
Zhou, Y. Norman [1 ,2 ]
机构：
[1] Tsinghua Univ, Dept Mech Engn, Key Lab Adv Mfg Mat Proc Technol, Minist Educ PR China, Beijing 100084, Peoples R China
[2] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2012年 / 41卷 / 07期
基金：
中国国家自然科学基金;
关键词：
Cu-Ag mixed NPs; lead-free; low-temperature bonding; electronics packaging; SILVER; GOLD; LEAD; ELECTROMIGRATION; ELECTRONICS; TECHNOLOGY; COPPER;
D O I：
10.1007/s11664-012-2008-7
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A simple method has been proposed to prepare polymer-protected Cu-Ag mixed nanoparticles (NPs), which are suitable for use as low-temperature bonding materials. The polymer coated on the Cu-Ag mixed NPs can protect them from oxidation effectively when heated in air at temperature lower than 280A degrees C. The low-temperature bonding process utilizing Cu-Ag mixed NPs as the bonding material is investigated. The bonding experiments show that robust joints are formed using Cu-Ag mixed NPs at 160A degrees C in air. The shear test shows that addition of copper to silver is helpful for improving joint strength. This novel sintering-bonding technology using Cu-Ag mixed NPs as an interconnection material has potential for application in the electronics packaging industry.
引用
收藏
页码：1886 / 1892
页数：7
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