Vendors waste no time responding to need for post-CMP treatment

被引：0
|
作者：
不详
机构：
来源：
MICRO | 1998年 / 16卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：16 / +
页数：3
相关论文
共 50 条
  • [21] Development of Post-CMP Cleaners for Better Defect Performance
    Cuong Tran
    Zhang, Peng
    Sun, Laisheng
    Penta, Naresh Kumar
    Lagudu, Uma Rames Krishna
    Shipp, Devon
    Babu, S. V.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 565 - 571
  • [22] On the impact of nanotopography of silicon wafers on post-CMP oxide layers
    Schmolke, R
    Deters, R
    Thieme, P
    Pech, R
    Schwenk, H
    Diakourakis, G
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2002, 5 (4-5) : 413 - 418
  • [23] High Productivity Combinatorial Analysis of Cu Post-CMP Cleans: Corrosion Protection and Queue Time
    Barnes, Jeff
    Liu, Jun
    Medd, Steve
    Cuong Tran
    Yin, David
    Zhang, Peng
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 613 - 618
  • [24] Investigating CMP and post-CMP cleaning issues for dual-damascene copper technology
    EKC Technology, Hayward, United States
    MICRO, 1 (7pp):
  • [25] Evaluating chemical mechanical cleaning technology for post-CMP applications
    de Larios, JM
    Zhang, J
    Zhao, E
    Gockel, T
    Ravkin, M
    MICRO, 1997, 15 (05): : 61 - +
  • [26] Influence of CMP slurries and post-CMP cleaning solutions on cu interconnects and TDDB reliability
    Yamada, Yohei
    Konishi, Nobuhiro
    Noguchi, Junji
    Jimbo, Tomoko
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (07) : H485 - H490
  • [27] An Advanced Fault Detection Method for Post-CMP Brush Scrubbers
    Hamaguchi, Yohei
    Aoyama, Shin
    Tayama, Tetsuya
    Miyatake, Tsuyoshi
    Kawaguchi, Hidehiko
    2018 INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING (ISSM), 2018,
  • [28] Possible post-CMP cleaning processes for STI ceria slurries
    Small, R
    Scott, B
    PARTICLES ON SURFACES 8: DETECTION, ADHESION AND REMOVAL, 2003, : 293 - 302
  • [29] Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning
    Hsieh, Chi-Hsiang
    Lee, Ming-Hsun
    Chen, Chao-Chang A.
    Tu, Chang-Ching
    Kuo, Hao-Chung
    MATERIALS RESEARCH EXPRESS, 2023, 10 (10)
  • [30] Relation between oxide-CMP induced defects and post-CMP cleaning strategies
    Devriendt, K
    Vrancken, E
    Heylen, N
    Grillaert, J
    Meuris, M
    Heyns, MM
    Lin, Z
    SOLID STATE PHENOMENA, 1999, 65-6 : 173 - 176
12345