Introduction to the Special Issue on the 2018 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0

作者：

Xu, Yong-Ping ^{[1
]}

Kuo, Tai-Haur ^{[2
]}

Straayer, Matt ^{[3
]}

Krishnaswamy, Harish ^{[4
]}

Natarajan, Arun ^{[5
]}

机构：

[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore, Singapore

[2] Natl Cheng Kung Univ, Mixed Signal Integrated Circuit Lab, Tainan, Taiwan

[3] Maxim Integrated, Adv R&D, North Chelmsford, MA 01863 USA

[4] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA

[5] Oregon State Univ, Sch Elect Engineeering & Comp Sci, Corvallis, OR 97330 USA

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2018年 / 53卷 / 12期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/JSSC.2018.2880171

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a set of the best papers selected from the 2018 IEEE International Solid-State Circuits Conference (ISSCC) that took place February 11-15, 2018, in San Francisco, CA, USA. This issue covers papers from the Analog, Power Management, Data Converters, RF, and Wireless committees. © 1966-2012 IEEE.

引用

页码：3343 / 3346

页数：4

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