Gas flow and heat transfer in reflow oven

被引：0

作者：

Hurban, Milan ^{[1
]}

Szendiuch, Ivan ^{[2
]}

Hejatkova, Edita ^{[2
]}

机构：

[1] Rehm TS, Brno, Czech Republic

[2] Brno Univ Technol, Dept Microelect, FEEC, Brno, Czech Republic

来源：

2018 41ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) | 2018年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

引用

页数：3

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