MEMS technology for optical interconnects

被引:0
|
作者
Ford, JE [1 ]
机构
[1] Univ Calif San Diego, Jacobs Sch Engn Elect & Comp Engn, La Jolla, CA 92093 USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:299 / 300
页数:2
相关论文
共 50 条
  • [21] Characterization of a MEMS Based Optical System for Free-Space Board-to-Board Optical Interconnects
    Chou, Jeffrey
    Yu, Kyoungsik
    Horsley, Dave
    Walmsley, Robert
    Tan, Mike
    Wang, S-Y
    Wu, Ming
    2010 CONFERENCE ON OPTICAL FIBER COMMUNICATION OFC COLLOCATED NATIONAL FIBER OPTIC ENGINEERS CONFERENCE OFC-NFOEC, 2010,
  • [22] Add/drop filters based on SiC technology for optical interconnects
    Vieira, M.
    Vieira, M. A.
    Louro, P.
    Fantoni, A.
    Silva, V.
    EMRS 2013 SPRING MEETING, SYMPOSIUM G: ALTERNATIVE APPROACHES OF SIC AND RELATED WIDE BANDGAP MATERIALS IN LIGHT EMITTING AND SOLAR CELL APPLICATIONS, 2014, 56
  • [23] Multi Gbls optical interconnects technology for computer and communication applications
    Ishak, WS
    18TH CONGRESS OF THE INTERNATIONAL COMMISSION FOR OPTICS: OPTICS FOR THE NEXT MILLENNIUM, TECHNICAL DIGEST, 1999, 3749 : 240 - 240
  • [24] The Future of Optical Interconnects for Data Centers: A Review of Technology Trends
    Aleksic, Slavisa
    PROCEEDINGS OF THE 14TH INTERNATIONAL CONFERENCE ON TELECOMMUNICATIONS CONTEL 2017, 2017, : 41 - 46
  • [25] MEMS technology and explosive growth fibre optical communication
    Liu, AQ
    PHOTONIC SYSTEMS AND APPLICATIONS, 2001, 4595 : 67 - 73
  • [26] MEMS technology - Micromachines enabling the "all optical network"
    Robinson, SD
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 423 - 428
  • [27] Optical interconnects - Optical interconnects can shrink PCs
    Noaker, PM
    LASER FOCUS WORLD, 1999, 35 (05): : 174 - 174
  • [28] OPTICAL INTERCONNECTS
    HINTON, HS
    MIDWINTER, JE
    OPTICAL AND QUANTUM ELECTRONICS, 1992, 24 (04) : R3 - R3
  • [29] Optical interconnects
    Chen, Ray T.
    Choi, Chulchae
    Synthesis Lectures on Solid State Materials and Devices, 2007, 2 : 1 - 103
  • [30] Optical interconnects by hot embossing for module and PCB technology - the EOCB approach
    Krabe, D.
    Scheel, W.
    Proceedings - Electronic Components and Technology Conference, 1999, : 1164 - 1166