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- [31] PERFORMANCE, WIREABILITY, AND COOLING TRADEOFFS FOR PLANAR AND 3-D PACKAGING ARCHITECTURES IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 339 - 345
- [32] Performance evaluation of 3D-interconnect architectures for network line cards PROCEEDINGS OF THE THIRD IASTED INTERNATIONAL CONFERENCE ON COMMUNICATIONS AND COMPUTER NETWORKS, 2005, : 351 - 356
- [33] Performance & Reliability of 3D Architectures (&UPI;fet, Finfet, Ωfet) 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2018,
- [34] RZBENCH: Performance Evaluation of Current HPC Architectures Using Low-Level and Application Benchmarks HIGH PERFORMANCE COMPUTING IN SCIENCE AND ENGINEERING, GARCH/MUNICH 2007, 2009, : 485 - 501
- [36] HPC performance analysis of a distributed information enterprise simulation USERS GROUP CONFERENCE, PROCEEDINGS, 2004, : 280 - 284
- [37] Performance Analysis of Emerging Data Analytics and HPC Workloads PROCEEDINGS OF PDSW-DISCS 2017: 2ND JOINT INTERNATIONAL WORKSHOP ON PARALLEL DATA STORAGE & DATA INTENSIVE SCALABLE COMPUTING SYSTEMS, 2017, : 43 - 48
- [38] Performance issues and performance analysis tools for HPC cloud applications: a survey Computing, 2013, 95 : 89 - 108
- [39] Investigation Of Leading HPC I/O Performance Using A Scientific-Application Derived Benchmark 2007 ACM/IEEE SC07 CONFERENCE, 2010, : 488 - 499