Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

被引：10

作者：

Guo, Qinhan ^{[1
]}

Zhao, Zhenjiang ^{[1
]}

Shen, Chunlong ^{[1
]}

机构：

[1] Taizhou Univ, Sch Shipping & Mechatron Engn, Taizhou 225300, Jiangsu, Peoples R China

来源：

MICROELECTRONICS RELIABILITY | 2017年 / 78卷

关键词：

Sn-10Bi; Sn-Ag-Cu; Strength; Creep; Bending; Fracture mode; CREEP-BEHAVIOR; RELIABILITY; STRENGTH; GROWTH; BI;

D O I：

10.1016/j.microrel.2017.08.004

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The comparison study of Sn-10Bi and Sn-3.0Ag-0.5Cu solder alloys and joints was conducted. The results showed that the liquidus of Sn-10Bi solder alloy was lower than that of Sn-Ag-Cu slightly. The interfacial IMCs layer growth of Sn-10Bi/Cu was slower than that of Sn-Ag-Cu/Cu during liquid/solid reaction. The higher strength and lower creep strain rate of Sn-10Bi comparing with that of Sn-Ag-Cu were contributed by the solid solution strengthening effect of Bi atom in beta-Sn phase. The ultimate bending load of Sn-10Bi joint was higher than that of Sn-Ag-Cu joint as the high strength of Sn-10Bi solder alloy. Moreover, the thinner and more flat IMCs layer also ensured the stable maximum bending displacement of Sn-10Bi joint at a loading speed of 1 mm/s compared with that of Sn-Ag-Cu joint. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：72 / 79

页数：8

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