Lead-free solder implementation: Reliability, alloy development, new technology - Foreword

被引：0
|
作者：
Chawla, Nik [1 ]
Chada, Srinivas
Kang, Sung K.
Kao, C. Robert
Lin, Kwang-Lung
Lucas, Jim
Turbini, Laura
机构：
[1] Arizona State Univ, Tempe, AZ 85287 USA
[2] Natl Cheng Kung Univ, Tainan 70101, Taiwan
[3] Michigan State Univ, E Lansing, MI 48824 USA
[4] Univ Toronto, Toronto, ON, Canada
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2006年 / 35卷 / 12期
关键词：
D O I：
10.1007/s11664-006-0315-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：2073 / 2073
页数：1
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