Development of a Simple Cup Method for Water Vapor Transmission Rate Measurements under High-temperature Conditions

被引：0
|
作者：
Iizuka, Shinya [1 ]
Murata, Kazuhide [1 ]
Sekine, Masahiro [2 ,3 ]
Sato, Chiaki [4 ]
机构：
[1] Saitama Ind Technol Ctr, Northern Lab, Saitama, Japan
[2] Saitama Ind Technol Ctr, Saitama, Japan
[3] Waseda Univ, Inst High Technol Prod Syst, Saitama, Japan
[4] Tokyo Inst Technol, Precis & Intelligence Lab, Yokohama, Kanagawa, Japan
来源：
2016 International Conference on Electronics Packaging (ICEP) | 2016年
关键词：
water vapor transmission rate; cup method; 60 degrees C 90% RH; 85 degrees C 85% RH; epoxy encapsulant;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A novel method has been studied to measure high-temperature water vapor transmission rates (WVTRs) for sealing materials such as epoxy encapsulants. Sealing materials are widely used as electronic components and must be moisture resistant under the damp heat test conditions for electronic components, e.g., 60 degrees C and 85 degrees C. To prevent samples from damage during high-temperature measurements using the conventional cup method, we built a new cup unit with a pressure-adjusting mechanism. This new cup is used to measure WVTRs without damaging the thin epoxy encapsulant membranes (thicknesses of 120-220 mu m). Arrhenius plots of the WVTRs for epoxy encapsulants measured by using the new cup exhibit linear relationships between temperatures of 25-85 degrees C.
引用
收藏
页码：522 / 525
页数：4
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