Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections

被引：0

作者：

Saito, Naoki ^{[1
]}

Murata, Naoakzu ^{[1
]}

Tamakawa, Kinji ^{[1
]}

Suzuki, Ken ^{[1
]}

Miura, Hideo ^{[1
]}

机构：

[1] Tohoku Univ, Fracture & Reliabil Res Inst, Grad Sch Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan

来源：

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年

关键词：

ELECTROPLATED-COPPER;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The change of the crystallinity of grain boundaries of the electroplated copper thin films used for the various interconnections in electronic products was evaluated quantitatively by applying an electron back-scattering diffraction analysis. It was found that the crystallinity of the electroplated films varied drastically depending on the electroplating conditions such as the composition of solute, temperature of the plating, the current density during electroplating, the surface material on the substrate, and so on. It also changed after the annealing at temperatures higher than 200 degrees C. The change of the crystallinity of the films caused the drastic variation of both the electrical and mechanical reliability of the films.

引用

页码：1153 / 1158

页数：6

共 50 条

[1] Improvement of the Crystallinity of Electroplated Copper Thin Films for Highly Reliable 3D Interconnections
Fan, Chuanhong
Asai, Osamu
Furuya, Ryosuke
Suzuki, Ken
Miura, Hideo
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1885 - 1890
[2] Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections
Mizuno, Ryota
Nakoshi, Yutaro
Suzuki, Ken
Miura, Hideo
2018 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP), 2018,
[3] Highly conductive grain boundaries in copper oxide thin films
Deuermeier, Jonas
Wardenga, Hans F.
Morasch, Jan
Siol, Sebastian
Nandy, Suman
Calmeiro, Tomas
Martins, Rodrigo
Klein, Andreas
Fortunato, Elvira
JOURNAL OF APPLIED PHYSICS, 2016, 119 (23)
[4] Quantitative Evaluation of the Quality of Grains and Grain Boundaries in Copper Thin Films used for 3D Interconnections
Murakoshi, Takuya
Suzuki, Ken
Miura, Hideo
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 69 - 72
[5] Quality Control of Grain Boundaries in Copper Thin Films Used for 3D Interconnections
Nakanishi, Takahiro
Suzuki, Ken
Miura, Hideo
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 88 - 91
[6] Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices
Mizuno, Ryota
Suzuki, Ken
Miura, Hideo
2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017, : 62 - 65
[7] Improvement of the Reliability of TSV Interconnections by Controlling the Crystallinity of Electroplated Copper Thin Films
Furuya, Ryosuke
Fan, Chuanhong
Asai, Osamu
Suzuki, Ken
Miura, Hideo
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 635 - 640
[8] Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections
Sakamoto, Hayato
Kato, Takeru
Suzuki, Ken
Miura, Hideo
2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
[9] QUANTITATIVE EVALUATION OF THE CRYSTALLINITY OF GRAIN BOUNDARIES IN POLYCRYSTALLINE MATERIALS
Murata, Naokazu
Suzuki, Ken
Miura, Hideo
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 8, 2012, : 389 - 395
[10] Influence of grain boundaries and interfaces on the electronic structure of polycrystalline CuO thin films
Morasch, Jan
Wardenga, Hans F.
Jaegermann, Wolfram
Klein, Andreas
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2016, 213 (06): : 1615 - 1624

← 1 2 3 4 5 →