Backside passivation for improving the noise performance in CMOS image sensor

被引:1
|
作者
Sun, Peng [1 ,2 ]
Hu, Sheng [2 ]
Zou, Wen [2 ]
Wang, Peng-Fei [1 ]
Chen, Lin [1 ]
Zhu, Hao [1 ]
Sun, Qing-Qing [1 ]
Zhang, David Wei [1 ]
机构
[1] Fudan Univ, Dept Microelect, State Key Lab ASIC & Syst, Shanghai 200433, Peoples R China
[2] Wuhan Xinxin Semicond Mfg Co Ltd, Wuhan 430205, Peoples R China
关键词
Image enhancement - MOS devices - Passivation - Dielectric devices - Metallic compounds - Transistors - Oxide semiconductors - Image sensors - Pixels - Charge coupled devices - CMOS integrated circuits - Silica;
D O I
10.1063/5.0006700
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Great efforts have been made in the past few years to reduce the white pixel noise in complementary metal-oxide-semiconductor (CMOS) image sensors. As a promising approach, the surface passivation method focusing on the field-effect passivation has been studied in this work. Based on the metal-oxide-semiconductor capacitor device model, electrical measurement and analysis have been performed for characterizing the charge distribution in the system. The relationship between the flat band voltage and the white pixel performance has been set up, and the proposed passivation method that controls Si or SiO2 interface charge or traps has been proved effective in lowering the white pixel noise, which can be very attractive in improving the performance of CMOS image sensors for high-resolution and high-sensitivity applications.
引用
收藏
页数:5
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