Correct By Design - as it impacts the printed circuit board

被引：0
|
作者：
Share, P
机构：
来源：
ELECTRONIC ENGINEERING | 1998年 / 70卷 / 861期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
While silicon gets much of the attention that relates to meeting: the pressure of "time to market" goals with increasingly complex and high clock frequency, high gate density designs, very little of that silicon arrives in the market place unaccompanied by printed circuit board or substrate of some kind. This paper examines how printed circuit design is changing in response to today's challenges.
引用
收藏
页码：65 / +
页数：3
相关论文
共 50 条
  • [31] Printed Circuit Board Material Characterization at Millikelvin Temperatures for Cryogenic Microwave Circuit Design
    Zocher, Nicole
    Pfahler, Tim
    Vossiek, Martin
    Carlowitz, Christian
    2024 54TH EUROPEAN MICROWAVE CONFERENCE, EUMC 2024, 2024, : 501 - 504
  • [32] COMPUTER-AIDED DESIGN FOR PRINTED CIRCUIT BOARD AND HYBRID CIRCUIT MANUFACTURING.
    Hewlett, Ray
    Robotics Amsterdam, 1985, 1 (03):
  • [33] The Design and Optimization of Combined Rogowski Coil Based on Printed Circuit Board
    Saetang, Pongchit
    Suksri, Amnart
    2016 3RD INTERNATIONAL CONFERENCE ON MANUFACTURING AND INDUSTRIAL TECHNOLOGIES, 2016, 70
  • [34] A particle swarm optimization approach in printed circuit board thermal design
    Alexandridis, Alex
    Paizis, Evangelos
    Chondrodima, Eva
    Stogiannos, Marios
    INTEGRATED COMPUTER-AIDED ENGINEERING, 2017, 24 (02) : 143 - 155
  • [35] Design of Printed Circuit Board Production using Water Jet Technology
    Gajdovcik, Peter
    Lehocka, Dominika
    Duplakova, Darina
    Botko, Frantisek
    Sitek, Libor
    TEM JOURNAL-TECHNOLOGY EDUCATION MANAGEMENT INFORMATICS, 2019, 8 (04): : 1313 - 1318
  • [36] Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board
    Hsieh, I-Wen
    Chen, Yu-Chi
    Hung, Shao-Kang
    2023 IEEE/ASME INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS, AIM, 2023, : 579 - 583
  • [37] Printed Circuit Board Electrical Design for Wafer-Level Packaging
    Wu, Boping
    Mo, Tingting
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 302 - 305
  • [38] Printed-circuit board changes enable new design possibilities
    Ajluni, C
    ELECTRONIC DESIGN, 1998, 46 (08) : 83 - +
  • [39] Thermal Design Method of Printed Circuit Board with Effective Thermal Conductivity
    Kondo, Daiji
    Hatakeyama, Tomoyuki
    Nakagawa, Shinji
    Ishizuka, Masaru
    2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2013, : 71 - 73
  • [40] Design of Printed Circuit Board for Retrofit Kit of Smart Energy Meters
    Ahuja, Kiran
    Khosla, Arun
    2018 FIRST INTERNATIONAL CONFERENCE ON SECURE CYBER COMPUTING AND COMMUNICATIONS (ICSCCC 2018), 2018, : 354 - 359
12345