Batch fabrication of polymer microsystems with shape memory microactuators

被引：0
|
作者：
Grund, T. [1 ]
Cuntz, T. [1 ]
Kohl, M. [1 ]
机构：
[1] Forschungszentrum Karlsruhe, Karlsruhe, Germany
来源：
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces the technologies of ultrasonic welding and heat-activated bonding for batch integration of micromachined polymer layers and shape memory alloy (SMA) foils or films. A series of ultrasonic welding tests is performed to achieve matter-free bonds on the wafer level with vertical accuracy of 1 mu m. Heat-activated bonding is tested for various pressure and temperature conditions using micromachined foils of 60 pin thickness. The technologies are combined in a new process flow for batch fabrication of mechanically active polymer microsystems. The process flow is validated by the fabrication and characterization of SMA-actuated polymer microvalves.
引用
收藏
页码：423 / 426
页数：4
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