Batch fabrication of polymer microsystems with shape memory microactuators

This paper introduces the technologies of ultrasonic welding and heat-activated bonding for batch integration of micromachined polymer layers and shape memory alloy (SMA) foils or films. A series of ultrasonic welding tests is performed to achieve matter-free bonds on the wafer level with vertical accuracy of 1 mu m. Heat-activated bonding is tested for various pressure and temperature conditions using micromachined foils of 60 pin thickness. The technologies are combined in a new process flow for batch fabrication of mechanically active polymer microsystems. The process flow is validated by the fabrication and characterization of SMA-actuated polymer microvalves.