Rheological Characterization of MR Polishing Fluid Used for Silicon Polishing in BEMRF Process

被引：37
|
作者：
Saraswathamma, K. [1 ]
Jha, Sunil [2 ]
Rao, P. Venkateswara [2 ]
机构：
[1] Osmania Univ, Dept Mech Engn, Hyderabad 500007, Andhra Pradesh, India
[2] Indian Inst Technol Delhi, Dept Mech Engn, New Delhi, India
来源：
MATERIALS AND MANUFACTURING PROCESSES | 2015年 / 30卷 / 05期
关键词：
Polishing; Carbonyl iron powder; Yield stress; Characterization; Rheology; Silicon; Viscosity; Stress; MR fluid; MAGNETORHEOLOGICAL FLUID; STRESS;
D O I：
10.1080/10426914.2014.994767
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The finishing mechanism of the ball-end magnetorheological finishing (BEMRF) process mainly depends on the stiffened hemispheroid, which is formed at the tool tip. Magnetorheological (MR) polishing fluid imparts strength to the polishing spot because of the effect of magnetic field strength. Behavior of this polishing fluid mainly depends on the size and shape of its constituents, volume concentration, particle size distribution, and applied magnetic field strength. A detailed study was undertaken on the role of carbonyl iron particle (CIP) size on the rheological behavior of the MR polishing fluid under various magnetic flux densities. Evaluation of the behavior of MR polishing fluid for silicon polishing was attempted through designing and fabrication of a parallel-plate magnetorheometer. Rheological characterization study was carried out using the Casson fluid model and the MR polishing fluid rheological properties, namely field-induced yield stress and shear viscosity were evaluated.
引用
收藏
页码：661 / 668
页数：8
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