Database on lead-free solders

被引：0
|
作者：
Siewert, TA [1 ]
Smith, DR [1 ]
Liu, S [1 ]
Madeni, JC [1 ]
机构：
[1] Natl Inst Stand & Technol, Div Mat Reliabil, Boulder, CO 80305 USA
来源：
51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE | 2001年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The worldwide movement in the electronics industry to replace lead-tin eutectic solders with lead-free solders creates a need for critical data on the industry's new lead-free solder compositions for these design and reliability models. Our team is working with the NEMI Lead-free Alloy Task Group to develop a comprehensive database.
引用
收藏
页码：1312 / 1314
页数：3
相关论文
共 50 条
  • [31] Mechanical properties of lead-free solders
    Darveaux, Robert
    Reichman, Corey
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 695 - +
  • [32] Tin pest in lead-free solders
    Kariya, Y
    Gagg, C
    Plumbridge, WJ
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (01) : 39 - 40
  • [33] Composite lead-free electronic solders
    Fu Guo
    Journal of Materials Science: Materials in Electronics, 2007, 18 : 129 - 145
  • [34] Trek toward lead-free solders
    Alpha Metals, Surrey, United Kingdom
    Surf Mount Technol Mag, 10
  • [35] MATERIALS UPDATE - LEAD-FREE SOLDERS
    JIN, SH
    MCCORMACK, M
    MATERIALS LETTERS, 1994, 20 (3-4) : 91 - 92
  • [36] The Recrystallization of Microelectronic Lead-Free Solders
    Hung, Fei-Yi
    Lui, Truan-Sheng
    Chen, Li-Hui
    Gu, Zhi-Feng
    MATERIALS TRANSACTIONS, 2008, 49 (10) : 2298 - 2302
  • [37] Lead-Free Solders for Superconducting Applications
    Aksoy, C.
    Mousavi, T.
    Brittles, G.
    Grovenor, C. R. M.
    Speller, S. C.
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2016, 26 (03)
  • [38] RESEARCH PROGRESS ON LEAD-FREE SOLDERS
    Hu, Yucai
    Cao, Fengjing
    Li, Fangxiao
    Ni, Guangchun
    Cui, Xicheng
    REVIEWS ON ADVANCED MATERIALS SCIENCE, 2011, 29 (02) : 150 - 155
  • [39] Design of lead-free solders and pollution control of lead
    Gan, Guisheng
    Du, Changhua
    Li, Chuntian
    CHEMICAL, MATERIAL AND METALLURGICAL ENGINEERING III, PTS 1-3, 2014, 881-883 : 1435 - 1438
  • [40] NEW TYPES OF LEAD-FREE SOLDERS AND THEIR PROPERTIES
    Drapala, Jaromir
    Petlak, Daniel
    Malcharczikova, Jitka
    Vodarek, Vlastimil
    Konecna, Katerina
    Smetana, Bedrich
    Zla, Simona
    Kostiukova, Gabriela
    Seidlerova, Jana
    Lasek, Stanislav
    Madaj, Michal
    Kroupa, Ales
    Urbanek, Jan
    Dusek, Karel
    Sedlacek, Josef
    Sidorov, Valerij Eugeny
    21ST INTERNATIONAL CONFERENCE ON METALLURGY AND MATERIALS (METAL 2012), 2012, : 1455 - 1466
12345