Drag effect of triple junctions on grain boundary and grain growth kinetics in aluminium

被引：54
|
作者：
Mattissen, D
Molodov, DA [1 ]
Shvindlerman, LS
Gottstein, G
机构：
[1] Rhein Westfal TH Aachen, Inst Met Kunde & Met Phys, D-52056 Aachen, Germany
[2] Russian Acad Sci, Inst Solid State Phys, Chernogolovka, Moscow District, Russia
来源：
ACTA MATERIALIA | 2005年 / 53卷 / 07期
关键词：
grain boundary; triple junction; mobility; von Neumann-Mullins relation; grain growth;
D O I：
10.1016/j.actamat.2005.01.016
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The motion and geometry of connected 2D grain boundary systems with triple junctions in aluminium was investigated in situ in an SEM with a specially designed heating stage. The results show that triple junctions can have a marked influence on grain boundary motion and grain growth. kinetics. The grain area change with annealing time was recorded in situ in the SEM. An analysis of the experimental data reveals that there is no unique relationship between growth rate and the number it of grain sides (von NeumannMullins relation). This is attributed to the effect of triple junction drag on grain growth. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：2049 / 2057
页数：9
相关论文
共 50 条
  • [41] The stability of triple junctions during the grain boundary diffusion process
    Rabkin, E
    Gust, W
    Shvindlerman, LS
    Aleshin, AN
    INTERFACE SCIENCE, 1996, 3 (04) : 269 - 277
  • [42] Grain growth and disperse particles: Impact of triple junctions
    Novikov, Vladimir Yu
    MATERIALS LETTERS, 2012, 84 : 136 - 138
  • [43] LINE TENSION OF GRAIN BOUNDARY TRIPLE JUNCTIONS IN THE COPPER TRICRYSTALS
    Zhao, Bingbing
    Shvindlerman, Lasar
    Gottstein, Guenter
    TMS 2014 SUPPLEMENTAL PROCEEDINGS, 2014, : 1063 - 1068
  • [44] Understanding grain boundary junctions: Effect of the grain size on microstructure evolution
    Mora, Luis. A. Barrales
    Shvindlerman, Lasar. S.
    Gottstein, Guenter
    RECRYSTALLIZATION AND GRAIN GROWTH IV, 2012, 715-716 : 186 - 190
  • [45] Wandering and nanolaminated structures of grain boundary triple junctions in tungsten
    Mazilova, T., I
    Sadanov, E., V
    Starchenko, I., V
    Mikhailovskij, I. M.
    MATERIALS LETTERS, 2020, 260
  • [46] NANOTOPOGRAPHY AND GRAIN-BOUNDARY MIGRATION IN THE VICINITY OF TRIPLE JUNCTIONS
    LAZARENKO, AS
    MIKHAILOVSKIJ, IM
    RABURKHIN, VB
    VELIKODNAYA, OA
    ACTA METALLURGICA ET MATERIALIA, 1995, 43 (02): : 639 - 643
  • [47] Structure and Atomic Profile of Grain Boundary Triple Junctions in Tungsten
    Sadanov E.V.
    Starchenko I.V.
    Ksenofontov V.A.
    Mikhailovskij I.M.
    Metallography, Microstructure, and Analysis, 2018, 7 (6) : 755 - 760
  • [48] Computer simulation of grain growth kinetics with solute drag
    Fan, D
    Chen, SP
    Chen, LQ
    JOURNAL OF MATERIALS RESEARCH, 1999, 14 (03) : 1113 - 1123
  • [49] Computer simulation of grain growth kinetics with solute drag
    D. Fan
    S. P. Chen
    Long-Qing Chen
    Journal of Materials Research, 1999, 14 : 1113 - 1123
  • [50] PREMELTING AT TRIPLE GRAIN JUNCTIONS
    RAJ, R
    ACTA METALLURGICA ET MATERIALIA, 1990, 38 (08): : 1413 - 1416
12345