Integrating Technical Debt Management and Software Quality Management Processes: A Framework and Field Tests

被引：0
|
作者：
Ramasubbu, Narayan [1 ]
Kemerer, Chris [1 ]
机构：
[1] Univ Pittsburgh, Pittsburgh, PA 15260 USA
来源：
PROCEEDINGS 2018 IEEE/ACM 40TH INTERNATIONAL CONFERENCE ON SOFTWARE ENGINEERING (ICSE) | 2018年
关键词：
Technical debt; software quality; software maintenance; software engineering economics; cost of quality; software product development; software process; case study;
D O I：
暂无
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
引用
收藏
页码：883 / 883
页数：1
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