共 50 条
- [41] Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate Journal of Electronic Materials, 2006, 35 : 433 - 442
- [42] ULTRASONIC-ATTENUATION DUE TO ELECTRON-LATTICE INTERACTION IN COPPER AND ALUMINUM ACUSTICA, 1976, 34 (04): : 241 - 243
- [43] Analysis of Orthogonal Test of Properties of Aluminum/Copper Ultrasonic Metal Welded Joints Luo, Zhen (lz@tju.edu.cn), 2018, Tianjin University (51): : 735 - 740
- [44] Effect of zinc interlayer on ultrasonic spot welded aluminum-to-copper joints MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 607 : 277 - 286
- [49] Consolidation of pure aluminum powders ADVANCES IN POWDER METALLURGY & PARTICULATE MATERIALS - 1997, 1997, : 1011 - 1019
- [50] FRICTION CONSOLIDATION OF ALUMINUM CHIPS FRICTION STIR WELDING AND PROCESSING VI, 2011, : 289 - 298