Thermal performance of water-cooled heat sinks: A comparison of two different designs

被引：0

作者：

Salem, TE ^{[1
]}

Porschet, D ^{[1
]}

Bayne, SB ^{[1
]}

机构：

[1] USN Acad, Dept Elect Engn, Annapolis, MD 21402 USA

来源：

TWENTY-FIRST ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2005 | 2005年

关键词：

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.

引用

页码：264 / 269

页数：6

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