Polymer material characterization and modeling

被引：0
|
作者：
Ernst, LJ [1 ]
机构：
[1] Delft Univ Technol, NL-2600 GA Delft, Netherlands
来源：
BENEFITING FROM THERMAL AND MECHANICAL SIMULATION IN MICRO-ELECTRONICS | 2000年
关键词：
polymers; materials modeling; constitutive relations; electronic packaging; curing; viscoelasticity;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In computational prototyping of electronic packages appropriate description of the mechanical behavior of polymers being included is required. An overview of presently available material models is presented. In particular a cure dependent linear-viscoelastic model is discussed more in detail. With this model the investigation of processing induced stress fields during and after fabrication is possible.
引用
收藏
页码：37 / 58
页数：22
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