Transmission laser welding of plastics for microsystem packaging

被引：0
|
作者：
Chen, JW [1 ]
Hessler, T [1 ]
机构：
[1] LEISTER Proc Technol, CH-6060 Sarnen, Switzerland
来源：
MICROENGINEERING 99, PROCEEDINGS | 1999年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Laser transmission welding is a new emerging technology for joining plastic parts. First applications find its way in industrial production environment. A precise, local, noncontact energy input makes this technology ideally suited for demanding applications requiring high quality and reproducibility in the joining process. The potential of laser transmission welding in microtechnology packaging is outlined, first results and applications are presented.
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页码：81 / 88
页数：8
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