Review of effect of ultrasound on electroless plating processes

被引:36
|
作者
Cobley, A. J. [1 ]
Mason, T. J. [1 ]
Saez, V. [1 ]
机构
[1] Coventry Univ, Sonochem Ctr, Fac Hlth & Life Sci, Coventry CV1 5FB, W Midlands, England
来源
基金
英国工程与自然科学研究理事会;
关键词
Ultrasound; Sonochemistry; Electroless; Nickel; Copper; Plating; COPPER; DEPOSITION; ACTIVATION; IRRADIATION; POWDER; FIELD;
D O I
10.1179/174591911X13170500147670
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
When an electrochemical process is performed in an ultrasonic field, a number of well known effects occur as a result of acoustic cavitation, including enhanced mass transport, thinning of the diffusion layer and localised heating. Sometimes described as sonoelectrochemistry, applying simultaneous ultrasonic irradiation with electrochemistry has proved beneficial in a range of applications that include electrodeposition, electrosynthesis and electroanalysis. Many studies of electroplating in an acoustic field have been carried out and reviews have been published. Electroless plating is also an electrochemical process with great importance to a number of industries including aerospace, electronics, photovoltaics and automotive. Among a range of benefits that have been found as a result of introducing ultrasound to these processes are improved plating rates, coverage and adhesion of the coatings. With modern demands for high speed plating, reduced manufacturing times and the plating of nanomaterials, it is timely to review the influence of ultrasound on electroless deposition processes.
引用
收藏
页码:303 / 309
页数:7
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