Spinel direct bonded refractory for copper converters

被引:0
|
作者
González, CAR [1 ]
Caley, WF [1 ]
Drew, RAL [1 ]
机构
[1] UANL, FIME, San Nicolas De Los Garza 66451, Mexico
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work addresses the need of new refractories for copper converters. Technological improvements and environmental regulations for chromium containing refractories have generated this need. Chemical interactions, mechanism of penetration and the effect of oxygen potential and temperature in the system Cu2S-FeS-SiO2-O-2 are presented for two refractories: a burned magnesite chrome brick (typically used by the copper industry) and a chrome-free spinel direct bonded brick. The main difference determined in the refractory performance was the blister copper penetration resistance; burned magnesite chrome brick is penetrated while direct bonded brick is not. These results are very promising since blister copper penetration has been reported as the major cause of refractory wear. The results are explained in terms of refractory porosity and wetting characteristics.
引用
收藏
页码:473 / 486
页数:14
相关论文
共 50 条
  • [21] Revisiting CA6 formation in cement-bonded alumina-spinel refractory castables
    Tomba Martinez, A. G.
    Luz, A. P.
    Braulio, M. A. L.
    Sako, E. Y.
    Pandolfelli, V. C.
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2017, 37 (15) : 5023 - 5034
  • [22] Corrosion behavior of silicon nitride bonded silicon carbide refractory material by molten copper and copper slag
    Yurkov, Audrey
    Malakho, Artem
    Avdeev, Victor
    CERAMICS INTERNATIONAL, 2017, 43 (05) : 4241 - 4245
  • [23] Recent developments of direct bonded copper (DBC) substrates for power modules
    Schulz-Harder, J
    Exel, K
    FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 491 - 496
  • [24] Application of direct bonded copper substrates for prototyping of power electronic modules
    Grzesiak, Wojciech
    Mackow, Piotr
    Maj, Tomasz
    Synkiewicz, Beata
    Witek, Krzysztof
    Kisiel, Ryszard
    Mysliwiec, Marcin
    Borecki, Janusz
    Serzysko, Tomasz
    Zupnik, Marek
    CIRCUIT WORLD, 2016, 42 (01) : 23 - 31
  • [25] In-Depth Microstructural Evolution Analyses of Cement-Bonded Spinel Refractory Castables: Novel Insights Regarding Spinel and CA6 Formation
    Sako, Eric Y.
    Braulio, Mariana A. L.
    Zinngrebe, Enno
    van der Laan, Sieger R.
    Pandolfelli, Victor C.
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2012, 95 (05) : 1732 - 1740
  • [26] Development of a ceramic-based composite for direct bonded copper substrate
    Akhtar, S. S.
    Kareem, L. T.
    Arif, A. F. M.
    Siddiqui, M. U.
    Hakeem, A. S.
    CERAMICS INTERNATIONAL, 2017, 43 (06) : 5236 - 5246
  • [27] The impact of bonite aggregate on the properties of lightweight cement-bonded bonite-alumina-spinel refractory castables
    Liu, Guangping
    Jin, Xuejun
    Qiu, Wendong
    Ruan, Guozhi
    Li, Yuanyuan
    CERAMICS INTERNATIONAL, 2016, 42 (04) : 4941 - 4951
  • [28] DIRECT-BONDED BASIC BRICK NEW POSSIBILITIES FOR COPPER CONVERTER OPERATOR
    BURKE, WC
    RENKEY, AL
    WENRICH, CF
    JOURNAL OF METALS, 1968, 20 (01): : A161 - &
  • [29] Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications
    Ben Kabaar, A.
    Buttay, C.
    Dezellus, O.
    Estevez, R.
    Gravouil, A.
    Gremillard, L.
    MICROELECTRONICS RELIABILITY, 2017, 79 : 288 - 296
  • [30] Spinel-bonded basic castables in relation to spinel-forming agents
    Das Poddar, Dipanjan
    Mukhopadhyay, S.
    InterCeram: International Ceramic Review, 2002, 51 (04) : 282 - 288