Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability

被引:9
|
作者
Chu, Min-Ching [1 ]
Meena, Jagan Singh [1 ]
Cheng, Chih-Chia [2 ]
You, Hsin-Chiang [1 ]
Chang, Feng-Chih [2 ]
Ko, Fu-Hsiang [1 ]
机构
[1] Natl Chiao Tung Univ, Inst Nanotechnol, Hsinchu 300, Taiwan
[2] Natl Chiao Tung Univ, Dept Appl Chem, Hsinchu 300, Taiwan
关键词
ELECTRICAL-PROPERTIES; THICKNESS; OXIDE;
D O I
10.1016/j.microrel.2010.05.004
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO2 film on a plastic polyimide substrate based on a simple and low-cost sal-gel precursor spin-coating process. The surface morphology of the ZrO2 film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO2 film under suitable treatment of oxygen (O-2) plasma and then subsequent annealing at 250 degrees C exhibits superior low leakage current density of 9.0 x 10(-9) A/cm(2) at applied voltage of 5 V and maximum capacitance density of 13.3 fF/mu m(2) at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O-2 plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O-2 plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1098 / 1102
页数:5
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