On-line chemical sensors for electroless gold plating.

被引：0
|
作者：
Sadik, O [1 ]
Xu, HW [1 ]
机构：
[1] SUNY Binghamton, Binghamton, NY 13902 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2001年 / 221卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
187-IEC
引用
收藏
页码：U582 / U583
页数：2
相关论文
共 50 条
  • [41] Controlled Pd deposition on fibers by electroless plating. The effects of the support on the reduction of nitrite in water
    Bosko, M. L.
    Marchesini, F. A.
    Cornaglia, L. M.
    Miro, E. E.
    CATALYSIS TODAY, 2013, 212 : 16 - 22
  • [42] INFLUENCE OF ULTRASONIC RADIATION ON CHEMICAL Ni-P PLATING.
    Matsuoka, Masasao
    Hayashi, Tadao
    Metal Finishing, 1986, 84 (03) : 27 - 31
  • [43] Piezoresistive sensors on textiles by inkjet printing and electroless plating
    Sawhney, Amit
    Agrawal, Animesh
    Patra, Prabir
    Calvert, Paul
    SMART NANOTEXTILES, 2006, 920 : 103 - 111
  • [44] ILLUSTRATED HISTORICAL DEVELOPMENT OF HIGH SURFACE LOADING, HIGH THROUGHPUT BARREL ELECTROLESS NICKEL PLATING.
    Gustar, R.E.
    Transactions of the Institute of Metal Finishing, 1981, 59 (03): : 93 - 96
  • [45] Gold wire bondability of electroless gold plating using disulfiteaurate complex
    H. Watanabe
    S. Abe
    H. Honma
    Journal of Applied Electrochemistry, 1998, 28 : 525 - 529
  • [46] Gold wire bondability of electroless gold plating using disulfiteaurate complex
    Watanabe, H
    Abe, S
    Honma, H
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 1998, 28 (05) : 525 - 529
  • [47] Electroless nickel/gold plating on copper based semiconductors
    Strandjord, AJG
    Popelar, SF
    Erickson, CA
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 196 - 201
  • [48] Factors influencing the electroless gold plating for ceramic packaging
    Zhang, Lei
    Liu, Sheng-Qian
    Liu, Qiao-Ming
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 463 - 465
  • [49] Fabrication of patterned gold microstructure by selective electroless plating
    Guan, F
    Chen, MA
    Yang, W
    Wang, JQ
    Yong, SR
    Xue, QJ
    APPLIED SURFACE SCIENCE, 2005, 240 (1-4) : 24 - 27
  • [50] Evaluation of substrate (Ni)-catalyzed electroless gold plating process
    Osaka, T
    Misato, T
    Sato, J
    Akiya, H
    Homma, T
    Kato, M
    Okinaka, Y
    Yoshioka, O
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (03) : 1059 - 1064
12345