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- [4] Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (04): : 539 - 547
- [5] Thermal Modeling of High Temperature Power Conversion Capacitors PROCEEDINGS OF THE 2012 IEEE INTERNATIONAL POWER MODULATOR AND HIGH VOLTAGE CONFERENCE, 2012, : 256 - 259
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- [8] Modeling and simulation of integrated capacitors for high frequency chip power decoupling IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (04): : 611 - 619
- [9] Experiments on behaviour of power silicon PN junctions under reverse bias voltage at high temperature THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 185 - 190