Determination of interfacial adhesion strength between oxide scale and substrate for metallic SOFC interconnects

被引:30
|
作者
Sun, X. [1 ]
Liu, W. N. [1 ]
Stephens, E. [1 ]
Khaleel, M. A. [1 ]
机构
[1] Pacific Northwest Natl Lab, Richland, WA 99354 USA
关键词
metallic interconnect; solid oxide fuel cell; oxide scale; interfacial strength; indentation test;
D O I
10.1016/j.jpowsour.2007.10.027
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The interfacial adhesion strength between the oxide scale and the substrate is crucial to the reliability and durability of metallic interconnects in solid oxide fuel cell (SOFC) operating environments. It is necessary, therefore, to establish a methodology to quantify the interfacial adhesion strength between the oxide scale and the metallic interconnect substrate, and furthermore to design and optimize the interconnect material as well as the coating materials to meet the design life of an SOFC system. In this paper, we present an integrated experimental/analytical methodology for quantifying the interfacial adhesion strength between the oxide scale and a ferritic stainless steel interconnect. Stair-stepping indentation tests are used in conjunction with subsequent finite element analyses to predict the interfacial strength between the oxide scale and Crofer 22 APU substrate. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:167 / 174
页数:8
相关论文
共 50 条
  • [11] DETERMINATION OF STRENGTH OF ADHESION OF A METALLIC COATING TO ITS BASE
    DOROZHKI.NN
    ZUEV, IM
    INDUSTRIAL LABORATORY, 1968, 34 (04): : 579 - &
  • [12] Experimental determination of the peel adhesion strength for metallic foils
    The Univ of British Columbia, Vancouver, Canada
    J Adhes Sci Technol, 4 (367-382):
  • [13] Experimental determination of the peel adhesion strength for metallic foils
    Breslauer, E
    Troczynski, T
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1998, 12 (04) : 367 - 382
  • [14] Experimental determination of the peel adhesion strength for metallic foils
    Breslauer, Edith
    Troczynski, Tom
    Journal of Adhesion Science and Technology, 1998, 12 (04): : 367 - 382
  • [15] Comments on the Quantification of Mechanical Adhesion Energy of Thermal Oxide Scale on Metallic Substrate Using Tensile Test
    Chandra-Ambhorn, S.
    Promdirek, P.
    Lothongkum, G.
    Wouters, Y.
    Galerie, A.
    HIGH TEMPERATURE CORROSION AND PROTECTION OF MATERIALS 7, PTS 1 AND 2, 2008, 595-598 : 907 - 914
  • [16] Effect of a metallic interfacial layer on peel strength deterioration between a Cu thin film and a polyimide substrate
    Iwamori, S
    Miyashita, T
    Fukuda, S
    Fukuda, N
    Sudoh, K
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (01): : 53 - 59
  • [17] A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
    Kim, Cheol
    Son, Kirak
    Kim, Gahui
    Kim, Sungtae
    Lee, Sol-Kyu
    Lee, So-Yeon
    Park, Young-Bae
    Joo, Young-Chang
    MICROELECTRONICS RELIABILITY, 2021, 116
  • [18] A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
    Kim, Cheol
    Son, Kirak
    Kim, Gahui
    Kim, Sungtae
    Lee, Sol-Kyu
    Lee, So-Yeon
    Park, Young-Bae
    Joo, Young-Chang
    Park, Young-Bae (ybpark@anu.ac.kr), 1600, Elsevier Ltd (116):
  • [19] The Effect of Mo Addition on Oxygen Vacancies in the Oxide Scale of Ferritic Stainless Steel for SOFC Interconnects
    Yun, Dae Won
    Jeong, Hi Won
    Seo, Seong Moon
    Lee, Hyung Soo
    Yoo, Young Soo
    CORROSION SCIENCE AND TECHNOLOGY-KOREA, 2024, 23 (01): : 33 - 40
  • [20] The structure of interfacial layer between the metallic coating and the polymer substrate
    Panchuk D.A.
    Sadakbaeva Zh.K.
    Puklina E.A.
    Bol'Shakova A.V.
    Abramchuk S.S.
    Yarysheva L.M.
    Volynskii A.L.
    Bakeev N.F.
    Nanotechnologies in Russia, 2009, 4 (5-6): : 340 - 348