Light Induced Plating of Silicon Solar Cells Using Boric Acid-Free Nickel Chemistry

被引：0

作者：

Munoz, Krystal ^{[1
]}

Michaelson, Lynne ^{[1
]}

Karas, Joseph ^{[2
]}

Tyson, Tom ^{[1
]}

Rand, James ^{[3
]}

Bowden, Stuart ^{[2
]}

机构：

[1] Tech Inc, Cranston, RI 02910 USA

[2] Arizona State Univ, Ira A Fulton Sch Engn, Tempe, AZ 85281 USA

[3] Core Energy Works, 304A Markus Ct, Newark, DE USA

来源：

2017 IEEE 44TH PHOTOVOLTAIC SPECIALIST CONFERENCE (PVSC) | 2017年

关键词：

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

A novel boric acid-free nickel plating chemistry has been developed to plate nickel onto silicon solar cells. This bath enables light induced plating (LIP) of nickel without the use of external rectification. The resulting deposit is low stress and has been shown to be an effective barrier to copper diffusion. Solar cells plated using this nickel bath demonstrate electrical, adhesion and reliability results similar to silver paste controls. In addition, these plated cells have lower contact resistance and higher metal conductivity than silver paste controls using similarly diffused wafers. The advantages of a boric acid-free nickel bath will be reviewed in detail.

引用

页码：925 / 930

页数：6

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