Graphene-Ag Composite Film as Thermal Interface Materials

被引：0

作者：

Huang, Sheng-Yun ^{[1
,2
]}

Zhang, Kai ^{[3
]}

Yuen, Matthew M. F. ^{[3
]}

Fu, Xian-Zhu ^{[1
,2
]}

Sun, Rong ^{[1
,2
]}

Wong, C. P. ^{[4
]}

机构：

[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China

[2] Shenzhen High Dens Elect Packaging & Device Assem, Shenzhen 518055, Peoples R China

[3] Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong, Hong Kong, Peoples R China

[4] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

来源：

2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年

关键词：

graphene; Ag nanoparticles; composite film; thermal interface materials; CONDUCTIVITY;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Significant enhancement in thermal diffusivity and thermal conductivity of graphene film, made from individual graphene oxide sheets, can be achieved upon modification with a small amount of Ag nanoparticles. It is readily rationalized in terms of not only the crosslink between the graphene sheets and Ag nanoparticles, but also the chemical intercalation of Ag nanoparticles into the gallery space between graphene basal planes.

引用

页数：2

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