Thermal Deformation Behavior and Processing Map of W80-Cu20 Composite by Hot Compressing

The thermal deformation behavior of W80-Cu20 composites were investigated by hot compression with Gleeble- 1500 thermal simulation system under deformation temperature range of 810 similar to 970 degrees C and strain rate range of 0.01 similar to 10 s(-1) with a true strain of 0.69. Based on modified dynamic materials model(MDMM) and Malas's criterion, the power dissipation map and hot processing map were established. Combined with microstructure, the reasonable parameters of hot processing were determined. And the damage modes of W80-Cu20 composite was analyzed. The results show that the true stress-true strain curves of W80-Cu20 composites are typical dynamic recrystallization (DRX) type curves, and the peak stress increases with the decreasing of deformation temperature and the increasing of strain rate. The preferable processing zones of W80-Cu20 composite were determined as follows: 840 similar to 885 degrees C, 0.2 similar to 1.42 s(-1) and 885 similar to 917 degrees C, 0.83 similar to 2.05 s(-1). The damage modes of W80-Cu20 composites involve Cu phase rupture, W-Cu interfacial separation, W-W grain boundary separation and W-grain crack.